抱歉,未找到符合的結果。

請嘗試使用不同或更廣泛的關鍵字。

探索 Innodisk 的工業級 DRAM

Innodisk 的工業級 DRAM 產品可說是應有盡有。寬溫 DRAM 模組極寬溫 DRAM 模組、30µ” 與 45µ” 金手指,以及 U型強固技術(Side Fill)等,都是 Innodisk 提供的優異工控選擇。然而,並非每位使用者都熟悉這些產品特點以及優勢。本文將介紹這些功能的特性、適合的應用場景,並提供選擇建議,幫助你做出最適合的決策。


什麼是 寬溫 DRAM 模組 ?

Innodisk 的 寬溫 DRAM 模組 專為極端環境設計,對於確保各種垂直市場的高效能至關重要。所有寬溫 DRAM 模組都能夠在 −40°C 低溫至 85°C 的高溫環境中穩定運作。同時,寬溫 DRAM 模組所採用的 30µ” 金手指,經過實測可承受溫度變化所引起的收縮與膨脹循環。這些模組提供多種型態選擇,包括 UDIMM、SODIMM、ECC UDIMM、ECC SODIMM 以及 RDIMM。

 

 

哪些應用適合寬溫 DRAM 模組 

Innodisk 的寬溫 DRAM 模組,不僅具備寬溫優勢,更提供多樣的模組規格、傳輸速率與容量選擇,能夠適合多種工業環境,特別是戶外 AIoT 應用。
 

什麼是極寬溫(Ultra Temperature)DRAM

Innodisk 極寬溫 DRAM 模組,相比前述的寬溫模組,可說是在溫度適應能力更上一層樓,能夠在 −40°C 至 125°C 的環境中穩定運作,在高溫耐受力上,比寬溫模組多出 40°C 的耐熱範圍。極寬溫 DRAM 模組的高溫耐受力,以及各樣工控優勢,得益於模組的 45µ” 金手指設計以及第三方單位的嚴苛驗證測試;測試項目包括:

  • 震動測試(MIL-STD-810G 514.7)
  • 溫度衝擊測試(MIL-STD-810G 503.6)
  • 包裝落下測試(ISTA-1A)
  • 彎曲測試(EIAJ-4072)
  • DRAM 模組插拔測試(100 次循環)
     

 

 

Who is Ultra Temperature DRAM For?

Due to Ultra Temperature’s unique ability to withstand temperatures up to 125°C, it is most suited to applications that are exposed to extreme heat, prolonged exposure to the sun, or in poorly ventilated areas. Systems inside trucks and other vehicles are particularly vulnerable to heat, not only because of the environments the vehicle may operate in, but due to the prolonged heat the components may be exposed to from the nearby engine.

 

What Are Gold Fingers?​

Gold fingers are gold-plated connectors that appear along the interfaces of PCBs. Coating the connectors of PCBs protects the connectors from various industrial issues, including temperature variation, shock, chemical corrosion, air pollution and humidity changes.

 

What’s the Difference Between 30µ” and 45µ” Gold Finger?​

Wide Temperature DRAM modules feature a 30µ” gold finger, which offers fantastic protection against the elements, and is suited for most industrial applications. Ultra Temperature DRAM uses a 45µ” gold finger, which allows even further protection due to the thicker layer of gold plating on the connecting interface of the modules.

 

What is Side Fill?

Innodisk’s Side Fill technology is a tried and tested solution of applying resin to three sides of a DRAM integrated circuit board during manufacturing. The Side Fill method of applying resin improves the strength of the module, and helps resist thermal and mechanical stress.

 

What is Anti-Sulfuration?

Anti-Sulfuration is a technology offered by Innodisk to combat sulphur gas corrosion, which is pervasive in many industries. Sulfuration can lead to lower connectivity and can shorten the lifespan of DRAM, and other components. To combat this, Innodisk’s Anti-Sulfuration products have a protective layer around vulnerable parts, which safeguards the silver alloys.

 

What is Conformal Coating?

Conformal coating is the process of applying a coating agent to components to protect them from the elements. Since Innodisk performs the entire conformal coating process internally, it is easy to adapt the coating to the demands of the customer. Innodisk can design the ideal coating thickness, coating technique, or coating substance for any application or use case.

 

How Can You Find the Right DRAM for Your Application?

With all these great industrial features, you may be wondering how you can pinpoint the perfect module for your use case. Instead of surfing through product pages and comparing specs, Innodisk offers SmartFilter™, a quick and easy way to find the product you need.

With the tool, you are able to select your application, such as healthcare or surveillance, and choose the technologies you need, like Wide Temperature, Side Fill or Anti-Sulfuration. After picking a suitable combination for your application, you will be recommended a series of products to consider, and you can compare until you find the best solution for your use case.

 

Further Reading

 

  1. Innodisk DRAM Modules
  2. How Industrial DRAM Withstands Corrosion, Wear & Other Damage

 

文章分享
載入中...