TECHNOLOGY

Thermal Shock

Thermal shock test simulates sudden transitions between hot and cold environments to evaluate the module's ability to withstand rapid temperature changes. (Test condition: -40°C ~ 110°C, 500 cycles)

Temperature Cycling

Temperature cycling is conducted to determine the resistance of the module to alternating extremes of high and low temperatures. (Test condition: -25°C ~ 100°C, 1000 cycles)

High Temperature & High Humidity Test

To determine the effects of time and temperature, under storage conditions, for thermally activated failure mechanisms and time-to-failure distributions of DRAM module. (Test condition: 85°C / 95% RH, 168hours , JEDEC J-STD-020C MSL Classifications)

Military Standard Thermal Shock

The military-level thermal shock test simulates sudden transitions between hot and cold environments to evaluate the module's ability to withstand rapid temperature changes. (Test condition: -40°C ~ 125°C, MIL-STD-810G 503.6)

4 Corner

Simulating extreme conditions, 4 corner test ensures the DRAM module’s performance and stability across four combinations of high and low voltage and temperature, and proves product functions and quality in various environments. (Test condition: -40°C / 95°C, ±5% voltage, 24 hours)

Burn-in Test

The Temperature Burn-in Test confirms that the DIMM can be read and written normally without errors under extraordinarily high and low-temperature conditions and eliminates all potential failures likely to occur in the early phase. (Test condition: -40°C / 25°C / 95°C, 24 hours)

PCB Bending Test

The bending test verifies the fatigue tolerance strength of the connection between the PCB and solder balls through pushing actions. This test ensures the DRAM modules perform reliably during shipping or systems exposed to vibration and physical stresses. (Test condition: deflection 1.2 mm, EIAJ-4702)

DRAM Module Insert & Extract Test

This test ensures the durability of the connector interface. It validates the robustness of the gold-plated contacts during repeated insertions and extractions, preventing wear and ensuring consistent electrical connections. (Test condition: 100 cycle, EIA-364-9)

Package Drop Test

The drop test assesses the DRAM module's durability and resilience to shocks and impacts during shipping and handling. It ensures that the module can withstand drops without sustaining damage, thus maintaining its functionality. (Test condition: drop height 76 cm, ISTA-1A)

Military Standard Vibration Test

The test assesses the ability to endure vibrations during operation and transport. It ensures the module's mechanical stability and reliable performance under various vibration conditions. (Test condition: vibration frequency 10 Hz ~ 500 Hz, MIL-STD-810G 514.7)

Vibration Test

The test assesses the ability to endure vibrations during operation and transport. It ensures the module's mechanical stability and reliable performance under various vibration conditions. (Test condition: vibration frequency 80 Hz ~ 2,000 Hz, IEC 60068-2-6)

Mechanical Shock Test

The purpose is to evaluate the reliability of DRAM module subjected to severe shocks which might result from suddenly applied forces or abrupt changes in motion produced by rough handling, transportation, or field operation. (Test condition: impact acceleration 1,500 g, IEC 60068-2-27)

Side Fill Pull Test

The pull test is to measure to what extent the Side Fill resin can resist bending, pressure after hardening. (Test condition Max. pull force: 56 kgf)

Rugged Clip Vibration Test

Vibration test for rugged clips assess their mechanical stability, ensuring that the clips securely hold the modules in place under various conditions, preventing dislodgement during operation. (Test condition: vibration frequency 20 Hz ~ 500 Hz, acceleration 3.1G (EIA 364-28 VII))

Anti-sulfuration Test

The anti-sulfuration test assesses the module’s resistance to sulfur-induced corrosion. It ensures that the module's silver components remain functional and reliable when exposed to sulfur-containing environments. (Test condition: 480 hours, ASTM B809-95)

Heat Sink Vibration

The heat sink vibration test ensures firm screws connection of the heat spreader under intensive vibration and secures heat spreader structure solidity. (Test condition: vibration frequency 20 Hz ~ 500 Hz, acceleration 3.1G)

Power On/Off Testing

The power on/off test generally ensures the DIMM can be turned on and off after continuously shutting down and restarting under extreme temperatures. (Test condition : -40°C / 95°C, 500 cycles each, IEC60068-2-2: 2007)

Auto Reboot

The auto-reboot test ensures the system can identify DIMM correctly during the system's auto-reboot at room temperature. (Test condition: 25°C, 500 cycles)

S3 Cycling

The S3 cycling test ensures the system can successfully wake up from the S3 sleep state and that no data errors occur at room temperature. (Test condition: 25°C, 500 cycles)