EXMP-Q911

Powered by : Qualcomm Dragonwing™ IQ-9075 SoC
Provides : Up to 100 TOPS (Dense) / 200 TOPS (Sparse) AI computing power
Features :

Compliant with COM-HPC Mini form factor
Up to 36 GB onboard memory and 128 GB UFS 3.1 storage
Dual 2.5G Ethernet and dual 4-lane MIPI CSI-2 interfaces
Industrial-grade design with operating temperature range from -40°C to 85°C (Ta)
Long-term chipset longevity supported through 2038

BORN FOR SUPERIOR PERFORMANCE

The Innodisk EXMP-Q911 COM-HPC Mini Module leverages Qualcomm’s latest innovation—the Dragonwing™ IQ-9075 SoC—to deliver high AI computing performance with low power consumption. Combined with Innodisk’s comprehensive customization services and self-developed software toolkit, it provides customers with a fast, time-to-market solution to stay ahead in the edge AI era.

POWERED BY QUALCOMM DRAGONWING™ SoCs

Best known for semiconductor leadership, Qualcomm introduced its brand-new “Dragonwing™” AI SoC portfolio, designed for the IoT, industrial, enterprise, and networking markets in the AI era.

Innodisk leverages this innovation to develop the EXMP-Q911 module, delivering high-performance, reliable, and scalable on-device AI computing with low power consumption at the edge.

VERIFIED PERFORMANCE, TRUSTED AI INFERENCE

Offering up to 100 TOPS (Dense) / 200 TOPS (Sparse) of AI computing, the module is tested and verified in real-world workloads, delivering excellent inference speed and performance across vision computing AI models and generative models.