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APEX-X100-Q
APEX-X100-Q
APEX-X100-Q
APEX-X100-Q

KI-LÖSUNGEN

Qualcomm Solution

APEX-X100-Q

Intel-Based AI System with Qualcomm Cloud AI 100 Ultra Accelerator

  • 870 TOPS with 128GB LPDDR4x memory for SLM, LLM, and GAI applications
  • Intel 13th Gen Core i7 CPU, 192GB RAM, 2TB SSD
  • High AI performance with just 150W power consumption
COMPUTING PLATFORM

Provide computing power with 870 TOPS on INT8.

DRAM MODULE

Supports up to 4 x Innodisk DDR5 4400 UDIMM modules, delivering up to 192GB of capacity.

FLASH STORAGE

Installed with 1 x Innodisk industrial-grade M.2 4TG2-P 2TB SSD featuring a PCIe Gen 4 x4 interface.

OOB MANAGEMENT

Built-in OOB (Out-of-band) remote management module.

I/O PORTS

Equipped with 3 x 2.5G RJ45 LAN ports, 1 x 10G RJ45 LAN port, 1 x USB 3.2 Gen 2 x2 (20Gbps) Type C, 8 x USB 3.2 Gen 2, and 2 x DP++.

OOB MANAGEMENT

Built-in OOB (Out-of-band) remote management module.

I/O PORTS

Equipped with 3 x 2.5G RJ45 LAN ports, 1 x 10G RJ45 LAN port, 1 x USB 3.2 Gen 2 x2 (20Gbps) Type C, 8 x USB 3.2 Gen 2, and 2 x DP++.

PRODUCT DETAILS AT A GLANCE

  1. 1Power Button
  2. 2Line-out
  3. 3Mic-in
  4. 4COM (RS-485 by RJ45)
  5. 5USB Type C (3.2 Gen 2 x2)
  6. 62.5G LAN (Supports 30W PoE)
  7. 7USB 3.2 Gen 2 x1
EDGE AI FPGA Solution in Factory Automation
  1. 82.5G LAN
  2. 9HDMI
  3. 10DP++
  4. 11DIO
  5. 12COM (RS-232/422/485)
  6. 13Power Input
EDGE AI FPGA Solution in Factory Automation

BORN FOR SUPERIOR PERFORMANCE

The APEX-X100-Q, powered by the Qualcomm Cloud AI 100 Ultra accelerator, is designed for SLM, LLM, and generative AI applications.

POWERFUL PROCESSING

The APEX-X100-Q delivers powerful computing performance. Equipped with Qualcomm’s latest Cloud AI 100 Ultra accelerator—featuring 870 TOPS (INT8), 128 GB VRAM, and a 150 W TDP—it is ideal for localized enterprise LLMs and on-premises multimodal language models.
 

EXCLUSIVE CHASSIS DESIGN

The flip-top casing design provides easy access for system maintenance, allowing for straightforward internal replacement of modules and components. Featuring a key-operated locking mechanism that eliminates the need for traditional screws.

DIVERSE I/O PORT OPTIONS

Equipped with 3 x 2.5G RJ45 LAN ports, 1 x 10G RJ45 LAN port, 1 x USB 3.2 Gen 2 x2 (20Gbps) Type C, 8 x USB 3.2 Gen 2 for high-speed connectivity.

VERSATILE AND COMPATIBLE COMPONENT OPTIONS

In addition to the pre-installed options, Innodisk offers flexible selections from our complete range of industrial-grade SSDs, DRAM modules, and embedded peripherals, all available for customization to meet specific needs.

HIGHLY CUSTOMIZED SERVICES

We provide customized AI system services with a flexible collaboration approach. While the included AI accelerator is the recommended option, we also offer a range of alternatives to meet specific requirements. Additionally, hardware, software, thermal solutions, firmware, BIOS, I/O, and system design can all be tailored to your exact needs.

  Contact Us > 
 

SPEZIFIKATIONEN

Platform

Intel CPU

Core i7-13700E

 Cores (P + E + LPE)

16C (8P + 8E)

 

Threads

24
 

Max. Frequency

5.1GHz

 Cache24MB
 CPU TDP65W
 BIOSAMI UEFI 256Mbit

AI Accelerator

AI Engine

Qualcomm Cloud AI 100 Ultra

 Form Factor (Interface)11.1cm H x 23.8cm L, single slot, full height (PCIe Gen 4 x16)
 

Computing Power

870 TOPS (INT8)
288 TFLOPS (FP16)
 GPU memory128GB LPDDR4x (w/ECC)

Memory

Technology / Socket

DDR5 4400 MT/s*1、4 x 288-pin DDR5 UDIMM

 

Max. Capacity

up to 192GB (4 x 48GB, total 192GB pre-installed)

GraphicsControllerIntel UHD Graphics 770
 Graphic EngineHardware encode: H.265/HEVC, H.264/MPEG-4 AVC, MPEG-2, JPEG/MJPEG and VP8 Hardware decode: H.265/HEVC, H.264/MPEG-4 AVC, MPEG-2, VC-1/WMV9, JPEG/MJPEG, VP8 and VP9

Displays

HDMI 2.0 (4K@30Hz)

1

 

DP++ 1.4 (4K@60Hz)

2

 

VGA

1 (optional, share the same connector with GPIO/DIO)

EthernetLAN (Marvell AQC113 10Gbps)1
 LAN (Intel I226 2.5Gbps)3 x (LAN2/3 support 802.at with 30W PoE)
Expansion SlotsM.2 2280 M Key1 x (PCIe Gen 4 x4) ,2TB M.2 SSD pre-installed
 M.2 2230 E Key1 x (PCIe Gen 3 x1 / USB 2.0)
 M.2 3052 B Key1 x (USB 3.2), with Nano SIM socket
 PCIe x161 x (Gen 4 x16 signal), Cloud AI 100 Ultra pre-installed or 1 x (Gen4 x8 signal)
 PCIe x161 x (Gen 4 x8 signal) *2
 PCIe x161 x (Gen 3 x4 signal)
 PCIe x41 x (Gen 3 x4 signal)
 PCIe x11 x (Gen 3 x1 signal)
External I/OCOM1RS232 / 422 / 485
 COM2RS232 / 422 / 485
 COM3RS485 (RJ45)
 USB 3.2 Gen 2x2 (20Gbps) Type C 11
 USB 3.2 Gen 2 (10Gbps)8
 Buttons1 x Power (with LED)
 Audio (Realtek ALC888S)Mic-in x 1, Line-out x 1
 GPIO/DIODefault 8-bit (4 in / 4 out)
Internal I/OSATA4 x 2.5" SATA III SSD / HDD (RAID 0 / 1 / 5 / 10)
PowerPower Input VoltageDC 24V ~ 48V (±5%)
 Power Consumption (Max.)24V@14A (with i7-13700E/ 2TB SSD/ 192GB DRAM/ Qualcomm Cloud AI 100 Ultra)
 Connector Type4 pin terminal block
EnvironmentOperating Temperature0°C ~ 40°C (with Qualcomm Cloud AI 100 Ultra)
 Storage Temperature-40 °C ~ 85 °C
 Operating Humidity5 ~ 90% Relative humidity, non-condensing
 Operating Vibration1Grms, IEC 60068-2-64, random, 5 ~ 500Hz, 1hr/axis, with SSD (operation, without
AI accelerator)
 Operating Shock10G, IEC 60068-2-27, half sine, 11ms duration, with SSD (operation, without AI
accelerator)
Watchdog TimerIntervalProgrammable from 1 to 255 Seconds
SecurityTPM 2.0dTPM2.0 (Hardware, Infineon:SLM9670AQ2.0)
 Out-of-band (OOB)1 x InnoAgent (RJ45)
MiscellaneousLED Indicator2 x Power LED, 2 x Fan LED, 2 x Temp LED
Physical CharacteristicsDimension L x W x H (mm)340 x 279 x 215
 Net Weight/Gross Weight (KG)10 / 16
 MountWall Mount/ Desk mount
 Antenna Holes6
Operating SystemLinux Ubuntu 22.04
RegulationSafetyCE / FCC / UKCA

BESTELLINFORMATIONEN

P/NIntel CPUAcceleratorCOMLANUSBSATADisplayStorageMemoryM.2Operating Temp.
APEX-X100-Q00Core i7-13700EQualcomm Cloud
AI 100 Ultra
349432TB192GB4 (2M+E+B)0 ~ 40°C

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