DDR4 Wide Temp. ECC UDIMM VLP

Features

Very low profile specialized for use in 1U system
ECC DIMM incorporates error correction and detection capabilities
Fully tested and optimized for stability and performance
Uses original IC to meet strict industrial standards
Anti-sulfuration protection against harsh environments
Operating Environment: -40°C ~ 95°C (Tc)
30μ’’ Gold Finger
RoHS Compliance, CE / FCC Certification

BORN FOR SUPERIOR PERFORMANCE

DDR4 Wide Temperature ECC UDIMM VLP is an industrial memory module for server and networking markets. It provides lasting performance, can operate from -40°C to 95°C (Tc) with 30μ” Gold Fingers, and includes single-bit error correction. The module is available in capacities of 8GB, 16GB, and 32GB, and data transfer rates of 2400MT/s, 2666MT/s, 2933MT/s, and 3200MT/s.

VLP modules are specialized for use in 1U systems, such as blade server data centers, where system height is lower than 1.18 inches. The design of these modules improves airflow inside the system and reduces thermal impact.

ECC function are designed to detect and correct single-bit errors that occur during data storage and transmission. ECC modules use Hamming Code or Triple Modular Redundancy for error detection and correction, and manage error corrections on their own, without requesting that the data source resend original data.

SAFEGUARDING MODULES WITH ANTI-SULFURATION PROTECTIVE LAYER

Sulfur is pervasive in many industries. When silver alloys in the DRAM chip encounters sulfur gasses a corrosion reaction occurs. This sulfuration causes lower conductivity and can quickly lead to product failure. To avoid this, Innodisk adds a protective layer above the vulnerable parts to safeguard the silver alloys.

Anti- Sulfuration >

PROVEN RELIABILITY THROUGH 3rd PARTY TESTING

Ensuring the durability and reliability of components is essential for meeting the demands of challenging environments. Our solutions undergo rigorous third-party testing, adhering to stringent industry standards. These tests validate the robustness of our products under extreme conditions, ensuring dependable performance across various applications.

Package Drop Test	Drop Height 76 cm, ISTA-1A
Thermal Shock	-40°C ~ 110°C, 500 Cycles
Military Standard Vibration Test	Vibration Frequency 10 Hz ~ 500 Hz MIL-STD-810G 514.7

TAILORED TO YOUR SPECIFIC NEEDS

SIDE FILL

Side Fill reinforces the connection between chips and the board, providing superior protection in environments with high vibration or mechanical stress.

CONFORMAL COATING

Conformal Coating applies a protective acrylic layer over the DRAM PCB, shielding it from harmful elements such as moisture, dust, and corrosive substances.

IMPLEMENTED WITH SUCCESS IN DYNAMIC ENVIRONMENTS

EDGE SERVER

Designed for edge computing, our products ensure stable performance in harsh conditions, supporting real-time data processing at the edge device.

DATA CENTER

Driving the backbone of modern computing, our solutions deliver high performance and reliability for data-intensive operations.

COMMUNICATION

Our solutions ensure reliable and uninterrupted performance, supporting networking and critical telecom infrastructure even under heavy loads.

SPECIFICATIONS

Model Name	DDR4 Wide Temperature ECC UDIMM VLP
DDR Generation	DDR4 Memory
DIMM Type	ECC UDIMM VLP
Speed	2400 MT/s, 2666 MT/s, 2933 MT/s, 3200 MT/s
Density	8GB, 16GB, 32GB
Function	ECC Unbuffered Memory
Pin Number	288pin
Bus Width	x72
Voltage	1.2V
PCB Height	0.738 Inches
Operating Temperature	-40°C ~ 95°C (Tc)
30μ” Gold Finger	Y
Anti-Sulfuration	Y

ORDER INFORMATION

P/N	IC Config.	Rank	Temp.	Description
M4C0-8GSST5EM	512M x 8	2R x 8	-40°C ~ 95°C (Tc)	DDR4 3200 8GB Wide Temp. ECC UDIMM VLP
M4C0-8GS1S5EM	1G x 8	1R x 8	-40°C ~ 95°C (Tc)	DDR4 3200 8GB Wide Temp. ECC UDIMM VLP
M4C0-AGS1T5EM	1G x 8	2R x 8	-40°C ~ 95°C (Tc)	DDR4 3200 16GB Wide Temp. ECC UDIMM VLP
M4C0-BGS2T5EM	2G x 8	2R x 8	-40°C ~ 95°C (Tc)	DDR4 3200 32GB Wide Temp. ECC UDIMM VLP