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M.2 (S42) 3TG6-P

Caractéristiques du produit
  • SATA III soultion for industrial field
  • Exclusive L³ architecture
  • Excellent random performance
  • Supports TRIM/NCQ/SMART
  • Built in iData Guard
  • Compatible with M.2 2242-D2-B-M standard
  • Designed with hardware LDPC ECC engine
Technologies mises en œuvre :
Utilisation:
Aperçu général Caractéristiques Informations sur la commande Ressource connexe +AJOUTER À LA QUESTION

Aperçu général:

Innodisk M.2 (S42) 3TG6-P is SATA III 6.0 Gb/s flash based disk, which delivers excellent performance, especially in random data transfer rate, and which offers reliability making it the ideal solution for a variety of applications, including embedded system, industrial computing, and enterprise field. M.2 (S42) 3TG6-P not only performs unmatched performance, but also designed with Innodisk owned technical knowhow to ensure the data integrity and highest levels of reliability.

Innodisk M.2 (S42) 3TG6-P is designed for industrial field, and supports several standard features, including TRIM, NCQ, and S.M.A.R.T. In addition, Innodisk’s exclusive industrial-oriented firmware provides a flexible customization service, making it perfect for a variety of industrial applications.

Caractéristiques :

Model NameM.2 (S42) 3TG6-P
InterfaceSATA III 6.0 Gb/s
Flash Type3D TLC
3D NAND Type64-layer | 96-layer | 112-layer
Capacity128GB~1TB
Sequential R/W (MB/sec, max.)560/510
Max. Power Consumption2.9W
Max. Channels4
Thermal SensorY
S.M.A.R.T.Y
ATA SecurityY
Dimension (WxLxH/mm)22.0 X 42.0 X 3.5
Vibration20G@7~2000Hz
Shock[email protected]
MTBF>3 million hours
Storage Temperature-40°C ~ +85°C
Operation TemperatureStandard Grade: 0°C ~ +70°C;
Industrial Grade: -40°C ~ +85°C

Informations sur la commande :

Operation Temp. 128GB 256GB 512GB 1TB
Standard Grade
(0°C ~ +70°C)
DGM24-A28M71%C*&F DGM24-B56M71%C*QF DGM24-C12M71%C*QF DGM24-01TM71%C*QF
Industrial Grade
(-40°C ~ +85°C)
DGM24-A28M71%W*&F DGM24-B56M71%W*QF DGM24-C12M71%W*QF DGM24-01TM71KWAQF

%. E: 64 layers 3D TLC; G: 96 layers 3D TLC; K: 112 layers 3D TLC
*. PCB version control
&. D=Dual channel; Q=4 channel

Ressources associées:



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