Under Ruggedness :

Side Fill Technology

Printed circuit boards keep getting smaller and more powerful. One drawback of this trend is that as solder joints shrinks they become more susceptible to thermal and mechanical stress. This is where Side Fill comes in as a cost effective method of strengthening your product.

Better Equipped for Tough Situations

Operation in shaky environments offer no threat as Side Fill strengthens the connection between the chips and the board – ensuring that your module remains operational in face of extreme mechanical stress.

Thriving in the Thermal Extremes

Temperature changes mean thermal expansion which in turn easily leads to fractures and weaker connections. Side Fill allows the separate parts more leeway while maintaining a strong connection. It also functions as a heat sink by increasing heat dissipation.

Side Fill allows the separate parts more leeway while maintaining a strong connection during temperature changes.

A High Reward with Low Cost

Side Fill is a simple and cost effective solution to improve robustness. When considering how costly component failure is, it should be a given addition to any module operating in harsh environments.