
M.2
Ultra iSLC Solution
M.2 (P110) 4IG2-P
Features
- Up to 100K P/E cycle, extending the lifespan by 33x
- Utilizes Ultra iSLC Technology
- Equipped with 112-layer 3D TLC NAND Flash
- Supports temperature -40°C to 85°C with dynamic thermal throttling to maintain SSD stability
- PLP (iCell) technology for power loss protection
- 5 years warranty and longevity commitment
The Innodisk M.2 (P110) 4IG2-P is an NVMe SSD in the standard M.2 form factor, featuring a PCIe Gen 4 x4 interface and 3D TLC NAND Flash. Equipped with its heat-dissipation design, the M.2 (P110) 4IG2-P efficiently disperses heat generated by the ICs, ensuring stable SSD performance. It also features Die RAID protection to reduce the occurrence of bad blocks and optimize data integrity.
100K P/E CYCLE, 33X LIFESPAN
The M.2 (P110) 4IG2-P, featuring BiCS5 112-layer 3D TLC NAND Flash and Innodisk's exclusive Ultra iSLC Technology, achieves an industry-leading 100K P/E cycle. This advancement extends the device lifespan by 33 times compared to conventional 3D TLC NAND Flash.

ENSURING STABILITY IN EXTREME ENVIRONMENTS
The M.2 (P110) 4IG2-P supports a wide temperature range from -40°C to 85°C and incorporates a Dynamic Thermal Throttling mechanism for real-time SSD monitoring. When the temperature reaches a critical threshold, it automatically issues commands to smoothly reduce read and write speeds, maintaining operational stability.

iCell Technology – POWER LOSS PROTECTION
Innodisk's iCell Technology safeguards mission-critical data on DRAM-based SSDs during unexpected power failures. Integrated iCells deliver an instantaneous charge to ensure data is securely stored, preventing any loss and ensuring data integrity.

AES 256-bit DATA ENCRYPTION & TCG Opal 2.0 SUPPORT
Innodisk SSDs utilize AES 256-bit encryption, the US government’s standard for securing confidential data, while also supporting TCG Opal 2.0 for enhanced device management and user-friendly authentication.

TAILORED TO YOUR SPECIFIC NEEDS
HEAT SINK CUSTOMIZATION
Innodisk provides different types of heat sinks to meet your specific storage needs.

IMPLEMENTED WITH SUCCESS IN DYNAMIC ENVIRONMENTS
SPECIFICATIONS
Model Name | M.2 (P110) 4IG2-P |
---|---|
Flash Type | iSLC (3D TLC) |
Interface | PCIe Gen 4 x4 |
Form Factor | M.2 22110 M Key |
Capacity | 160GB ~ 1.28TB |
Sequential R / W (MB/sec, max.) | 6,900 / 4,350 |
P/E Cycle | 100,000 |
TBW (Max.) | 85,506 |
Storage Temperature | -40°C ~ 85°C |
Max. Power Consumption | 10.2W |
Max. Channels | 8 |
External DRAM Buffer | Y |
Features | PLP (iCell), AES, TCG Opal 2.0, S.M.A.R.T. |
Dimension (W x L x H/mm) | Pure M.2 : 22.0 x 110.0 x 2.87 S/T with heat-spreading copper layer : 22.0 x 110.0 x 3.3 W/T with heat sink : 25.0 x 110.0 x 14.45 |
Vibration | 20G@[7 ~ 2000Hz] |
Shock | [email protected] |
MTBF | >3 million hours |
Warranty | 5 Years |
ORDER INFORMATION
Operating Temperature | Standard Grade (0°C ~ 70°C) | Industrial Grade (-40°C ~ 85°C) |
160GB | DHM21-A60DP1KCBELP | DHM21-A60DP1KWBELPH |
320GB | DHM21-D2GDP1KCBELP | DHM21-D2GDP1KWBELPH |
640GB | DHM21-F4GDP1KCBELP | DHM21-F4GDP1KWBELPH |
1.28TB | DHM21-1T2DP1KCBEQP | DHM21-1T2DP1KWBEQPH |
For TCG Opal function, the PN Code 10th ~ 12th will be DP2.