DDR3
ECC Unbuffered Memory
DDR3 ECC SODIMM ULP
Features
- Small outline dual in-line memory module
- Ultra low profile feature specialized for use in 1U system
- ECC DIMM incorporates error correction and detection capabilities
- Fully tested and optimized for stability and performance
- Uses original IC to meet strict industrial standards
- 30μ” Gold Finger
- RoHS Compliance
- CE / FCC Certification
DDR3 ECC SODIMM ULP is an ultra low-profile, compact industrial memory module that provides lasting performance, and is designed for the server, telecom and networking markets. The modules come equipped with 30μ” Gold Fingers and include single bit error correction. 2GB and 4GB capacities are available, as well as data transfer rates of 1333MT/s and 1600MT/s.
ULP modules are specialized for use in 1U systems, such as blade server data centers, where system height is lower than 1.18 inches. The design of these modules improves airflow inside the system and reduces thermal impact.
ECC function is designed to detect and correct single-bit errors that occur during data storage and transmission. ECC modules use Hamming Code or Triple Modular Redundancy for error detection and correction, and manage error corrections on their own, without requesting that the data source resend the original data.
PROVEN RELIABILITY THROUGH 3rd PARTY TESTING
Ensuring the durability and reliability of components is essential for meeting the demands of challenging environments. Our solutions undergo rigorous third-party testing, adhering to stringent industry standards. These tests validate the robustness of our products under extreme conditions, ensuring dependable performance across various applications.
| Package Drop Test | Drop Height 76 cm, ISTA-1A |
| Thermal Shock | -40°C ~ 110°C, 500 Cycles |
TAILORED TO YOUR SPECIFIC NEEDS
SIDE FILL
Side Fill reinforces the connection between chips and the board, providing superior protection in environments with high vibration or mechanical stress.
CONFORMAL COATING
Conformal Coating applies a protective acrylic layer over the DRAM PCB, shielding it from harmful elements such as moisture, dust, and corrosive substances.
IMPLEMENTED WITH SUCCESS IN DYNAMIC ENVIRONMENTS
EDGE SERVER
Designed for edge computing, our products ensure stable performance in harsh conditions, supporting real-time data processing at the edge device.
DATA CENTER
Driving the backbone of modern computing, our solutions deliver high performance and reliability for data-intensive operations.
SPECIFICATIONS
| Model Name | DDR3 ECC SODIMM ULP |
|---|---|
| DDR Generation | DDR3 Memory |
| DIMM Type | ECC SODIMM ULP |
| Speed | 1333 MT/s, 1600 MT/s |
| Density | 2GB, 4GB |
| Function | ECC Unbuffered Memory |
| Pin Number | 204pin |
| Bus Width | x72 |
| Voltage | 1.35V, 1.5V |
| PCB Height | 0.709 Inches |
| Operating Temperature | 0°C ~ 85°C |
| 30μ” Gold Finger | Y |
ORDER INFORMATION
P/N | IC Config. | Rank | Temp. | Description |
M3D0-2GMJ25QE | 256M x 8 | 1R x 8 | 0°C ~ 85°C | DDR3 1866 2GB ECC SODIMM ULP |
M3D0-4GMS25QE | 256M x 8 | 1R x 8 | 0°C ~ 85°C | DDR3 1866 4GB ECC SODIMM ULP |
M3D0-2GMJ24QE | 512M x 8 | 1R x 8 | 0°C ~ 85°C | DDR3L 1866 2GB ECC SODIMM ULP |
M3D0-4GMS24QE | 512M x 8 | 1R x 8 | 0°C ~ 85°C | DDR3L 1866 4GB ECC SODIMM ULP |
*Please contact Innodisk for products with other speeds.
