Innodisk Ultra Temperature DDR4 DRAM Module
Handles Up To 125℃


System heat constraints are a constant headache for system designers who must accommodate heat-sensitive components into their designs. This constraint is an increasingly big problem as modern designs become more and more compact where heat-generating intensive computing and data processing in closed installation spaces.

Ultra Temperature memory eradicates these issues in one step, going beyond the typical industrial-grade temperature range to support from -40℃ to 125℃.

Extended temperature support will prove extremely valuable for the following applications: 



Self-driving vehicles
Self-driving vehicles

Self-driving vehicles must do double-duty in dealing with the increased data processing demands and extra heat for autonomous vehicles and the small unventilated enclosure they work in.

Fanless systems
Fanless systems

Fanless embedded systems typically operate in harsh environments with less room to add the deep cooling fins and fans where are likely to crash or get damaged if their system temperature exceeds specifications.

Mission-critical systems
Mission-critical systems 

Mission-critical systems demand complete reliability in environments that are not hospitable to electronics, often operating with ambient temperatures that would destroy an average system.

Value-added Extras

Innodisk offers free product upgrades to ensure performance in every critical environments.

45µ” Gold Finger

45µ” Gold Finger 

Provides a tougher, more reliable connection than typical 30µ” gold fingers on industrial-grade DRAM.

Side Fill

Side Fill

Protects and strengthens delicate solder joints against thermal and mechanical stress.

Anti-Sulfuration

Anti-Sulfuration

An additional protective layer above vulnerable parts protects against sulfur corrosion of silver alloys.

Thermal Sensor

Thermal Sensor

Built-in temperature sensor accurately measures and tracks component temperature.

Certification

With the original IC and components that meet AEC-Q200 automotive qualification, the new series is also verified by
third-party testers to ensure it meets the rigorous requirements that the Ultra Temperature label represents.

Gold Finger Insertion & Extraction

Gold Finger
Insertion & Extraction

Gold finger insert and extract tests (100 cycles)

Thermal Shock & Vibration Test

Thermal Shock
& Vibration Test

MIL-STD-810G
United States Standard 

Drop Test

Drop Test


ISTA-1A
International Safe Transit Association

Bending Test

Bending Test


EIAJ-4072
Electronic Industries
Association of Japan

Ultra Temperature DRAM module has the potential to eliminate one of the biggest roadblocks in computer design by simply accommodating higher temperatures. This development can streamline the development of all the systems mentioned earlier. This fares well when combined with the general growth of these markets. Self-driving cars show a positive market outlook, and according to a recent market research report, the demand is set to rise from USD 23.33 Billion in 2020 to USD 64.88 Billion by 2026, a CAGR of 22.7% from 2021 to 2026.

Selection Guide

Check out our Selection Guide for the latest flash storage, DRAM, embedded peripherals, and software solutions.

Need More Help?

Contact us and let us know how we can help you with
your inquiries.

© Copyright 2021 Innodisk Corporation - All Rights Reserved